Filling small dimension vias using supercritical carbon dioxide

Details Filling small dimension vias using supercritical carbon dioxide Filling small dimension vias using supercritical carbon dioxide

2007-06-19

2007-06-19

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23011

Reexamination Certificate

active

10943634

ABSTRACT:
Suitable particles may be deposited within an extremely small high-aspect ratio via by flowing the particles in a suspension using supercritical carbon dioxide. The particles may be made up of diblock copolymers or silesquioxane-based materials or oligomers of phobic homopolymers or pre-formed silica-based particles stabilized using diblock copolymers and may include chemical initiators to permit in situ polymerization within the via.

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patent: 2005/0110145 (2005-05-01), Elers

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