Field-shielded SOI-MOS structure free from floating body...

Active solid-state devices (e.g. – transistors – solid-state diode – Schottky barrier – In integrated structure

Reexamination Certificate

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C438S400000, C257S349000

Reexamination Certificate

active

07019378

ABSTRACT:
A silicon-on-insulator structure provides an effective drift field for holes, and simultaneously enhanced recombination centers for holes and electrons. The structure includes a silicon substrate, an oxide insulation layer disposed above the silicon substrate, a silicon body layer disposed above the oxide insulation layer, and a field shield gate disposed above the silicon body layer. The field shield gate includes a conductor portion, and an alumina insulation layer disposed beneath the conductor portion. The oxide insulation layer and the silicon body layer each include at least one channel stop region, and at least one recombination center for the recombination of positive- and negative-charge carriers. The effective drift field and enhanced recombination centers facilitate the rapid recombination of the charge carriers, leading to a very small recombination time constant, which overcomes the floating body effect associated with conventional silicon-on-insulator structures.

REFERENCES:
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“SOI and Device Scaling,” C. Hu, Proceedings of IEEE International SOI Conference, Oct. 1998, pp. 1-4.
“SOI Floating-Body, Device and Circuit Issues,” J. Gautier, et al., IEDM, 1997, pp. 407-410.
“CAD-Compatible High-Speed CMOS/SIMOX Gate Array Using Field-Shielded Isolation,” T. Iwamatsu, et al., IEEE Trans. Elec. Devices, vol. 42, No. 11, 1995, pp. 1934-1938.
“Suppression of Delay Time Instability on Frequency using Field Shield Isolation Technology for Deep Sub-Micron SOI Circuits,” S. Maeda, et al., IEDM, 1996, pp. 129-132.
“BESS: A Source Structure that Fully Suppresses the Floating Body Effects in SOI CMOSFETs,” M. Horiuchi, et al., IEDM 1996, pp. 121-124.
“A Novel SiGe-Inserted SOI Structure for High Performance PDSOI CMOSFETs,” G.J. Bae, et al., IEDM, 2000, pp. 667-670.

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