Field emission device and method of making the same

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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1566621, 1566431, 313309, H01L 2100, H01J 102, B44C 122

Patent

active

054494354

ABSTRACT:
A method for forming a field emission device. A substrate is selectively patterned. An etch is performed to remove portions of the substrate to form protrusions. An oxidation is performed to the substrate that forms a first oxidized layer. A perpendicular etch is performed that removes portions of the first oxidized layer. A second oxidation is performed to the substrate that forms a second oxidized layer. A conductive or semiconductive layer is deposited onto the second oxidized layer. An etch is performed to remove a portion of the first oxidized layer and a portion of the second oxidized layer to expose the protuberance.

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patent: 5064396 (1991-11-01), Spindt
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patent: 5201992 (1993-04-01), Marcus et al.

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