Field effect transistor having polycrystalline silicon gate junc

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257407, 257653, 257403, 257756, H01L 2978, H01L 2904, H01L 2906

Patent

active

053713966

ABSTRACT:
A field effect transistor includes a polycrystalline silicon gate having a semiconductor junction therein. The semiconductor junction is formed of first and second oppositely doped polycrystalline silicon layers, and extends parallel to the substrate face. The polycrystalline silicon gate including the semiconductor junction therein is perfectly formed by implanting ions into the top of the polycrystalline silicon gate simultaneous with implantation of the source and drain regions. The semiconductor junction thus formed does not adversely impact the performance of the field effect transistor, and provides a low resistance ohmic gate contact. The gate need not be masked during source and drain implant, resulting in simplified fabrication.

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A Novel p-n Junction Polycrystalline Silicon Gate MOSFET, K. V. Anand et al., Int. J. Electronics, vol. 54, No. 2, 1983, pp. 287-298.

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