Field effect transistor and method for manufacturing the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S142000, C438S151000, C438S283000, C257S190000, C257S347000, C257SE21403

Reexamination Certificate

active

07923314

ABSTRACT:
A method for manufacturing a field effect transistor, includes: forming a mask of an insulating film on a semiconductor layer containing Si formed on a semiconductor substrate; forming the semiconductor layer into a mesa structure by performing etching with the use of the mask, the mesa structure extending in a direction parallel to an upper face of the semiconductor substrate; narrowing a distance between two sidewalls of the mesa structure and flattening the sidewalls by performing a heat treatment in a hydrogen atmosphere, the two sidewalls extending in the direction and facing each other; forming a gate insulating film covering the mesa structure having the sidewalls flattened; forming a gate electrode covering the gate insulating film; and forming source and drain regions at portions of the mesa structure, the portions being located on two sides of the gate electrode.

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Notification of Reasons for Rejection issued by the Japanese Patent Office on Aug. 21, 2009, for Japanese Patent Application No. 2007-262344, and English-language translation thereof.
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