Field effect transistor and method for fabricating it

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

Reexamination Certificate

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Details

C257S314000, C257S315000, C257S329000, C257S330000, C257S331000, C257S622000, C257S623000, C257SE21609, C257SE21693, C257SE29201

Reexamination Certificate

active

07119384

ABSTRACT:
The invention relates to a field effect transistor in which the planar channel region on the upper surface of the elevation is extended in width by means of additional vertical channel regions on the lateral surfaces of the elevation. Said additional vertical channel regions connect directly to the planar channel region (vertical extended channel regions). Said field effect transistor has the advantage that a significant increase in the effective channel width for the current flow IONcan be guaranteed relative to conventional transistor structures used up until the present, without having to accept a reduction in the achievable integration density. Said field effect transistor furthermore has a low reverse current IOFF. The above advantages are achieved without the thickness of the gate insulators up to the region of the charge transfer tunnels having to be reduced or a reduced stability.

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patent: WO 00/30181 (2000-05-01), None
Xuejue Huang et al., “Sub 50-nm FinFET: PMOS,” Dept. of Electrical Engineering and Computer Sciences, University of California at Berkeley, CA 94720.

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