Fiber optic semiconductor analysis arrangement and method...

Details Fiber optic semiconductor analysis arrangement and method... Fiber optic semiconductor analysis arrangement and method...

2005-01-18

2005-01-18

Nguyen, Tu T. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

Reexamination Certificate

active

06844928

ABSTRACT:
The operability of light-based semiconductor die analysis is enhanced using a method and arrangement that directs light between a light source and a die. In one example embodiment of the present invention, a light source is directed to a die in a semiconductor analysis arrangement using a fiber optic cable. The analysis arrangement is adapted to use light received via the fiber optic cable to analyze the die. The analysis includes one or more light-based applications, such as stimulating a selected portion of the die with the light and detecting a response therefrom. In this manner, light can be directed to a die in a variety of analysis implementations, such as for analyzing a die in a test chamber.

REFERENCES:
patent: 4683750 (1987-08-01), Kino et al.
patent: 6395563 (2002-05-01), Eriguchi

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