Ferroelectric thin film device and its process

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428210, 428701, 428702, B32B 300

Patent

active

058662383

ABSTRACT:
A first ferroelectric thin film device is provided with a first substrate consisting of polycrystal, amorphous material or metal material and a first ferroelectric thin film formed on the first substrate. The average of thermal expansion coefficients of the substrate from room temperature to temperature for forming the ferroelectric thin film is 70.times.10.sup.-7 /.degree.C. or more. At least 75% of crystal axes of the first ferroelectric thin film are oriented in <001>-direction. A second ferroelectric thin film device is provided with a second substrate consisting of amorphous material and a second ferroelectric thin film formed on the second substrate. The average of thermal expansion coefficients of the substrate from room temperature to temperature for forming the ferroelectric thin film is 50.times.10.sup.-7 /.degree.C. or less. At least 75% of crystal axes of the second ferroelectric thin film are oriented in <100>direction.

REFERENCES:
patent: 4803392 (1989-02-01), Kushida et al.
patent: 5155658 (1992-10-01), Inam et al.
patent: 5225031 (1993-07-01), McKee et al.
patent: 5323023 (1994-06-01), Fork
patent: 5403673 (1995-04-01), Haga et al.
Doss, "Engineers Guide to High-Temperature Superconductivity", Wiley and Sons, 1989, p. 267.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ferroelectric thin film device and its process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ferroelectric thin film device and its process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ferroelectric thin film device and its process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1115273

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.