Ferroelectric polymer memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257SE21663, C257SE21664, C257SE27104, C438S003000

Reexamination Certificate

active

07808024

ABSTRACT:
A ferroelectric polymer memory module includes a first set of layers including: a first ILD layer defining trenches therein; a first electrode layer disposed in the trenches of the first ILD layer; a first conductive polymer layer disposed on the first electrode layer and in the trenches of the first ILD layer; and a ferroelectric polymer layer disposed on the first conductive polymer layer and in the trenches of the first ILD layer; and a second set of layers disposed on the first set of layers to define memory cells therewith, the second set of layers including: a second ILD layer defining trenches therein; a second conductive polymer layer disposed in the trenches of the second ILD layer; and a second electrode layer disposed on the second conductive polymer layer.

REFERENCES:
patent: 2003/0179617 (2003-09-01), Gudesen et al.
patent: 2003/0206434 (2003-11-01), Leushner
patent: 2003/0224535 (2003-12-01), Andideh et al.
patent: WO02/43071 (2002-05-01), None
patent: WO03/041084 (2003-05-01), None
patent: WO03/046995 (2003-06-01), None
patent: WO-03046924 (2003-06-01), None
patent: WO-2006036691 (2006-04-01), None
patent: PCT/US2005/033811 (2006-06-01), None
Office Action from German Patent Application No. 112005002299.4-33 mailed Apr. 14, 2009, 6 pgs.
Third Office Action from Korean Patent Application No. 2007-7006973 mailed Jan. 23, 2009, 6 pgs.
Decision on Rejection from Chinese Patent Application No. 200580032639.7 mailed Jun. 5, 2009, 22 pgs.
Office Action from Korean Patent Application 2007-7006973 mailed Jan. 23, 2009, 6 pgs.
First Office Action from Chinese Patent Application No. 200580032639.7, mailed Sep. 5, 2008, 28 pgs.
International Preliminary Report on Patentability from PCT/US2005/033811, mailed Apr. 5, 2007, 8 pgs.
First Office Action from Korean Patent Application No. 2007-7006973, mailed Feb. 15, 2008, 2 pgs.
Second Office Action from Korean Patent Application No. 2007-7006973, mailed Aug. 13, 2008, 4 pgs.

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