Ferroelectric memory device and method of manufacture of same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257SE27104, C257S379000, C438S003000

Reexamination Certificate

active

07408213

ABSTRACT:
A ferroelectric memory device has a lower insulating film formed on a semiconductor substrate. A ferroelectric capacitor structure is formed on the lower insulating film. The ferroelectric capacitor structure is created by layering in order a lower electrode, ferroelectric layer and upper electrode. The ferroelectric memory device also has an upper insulating film which covers the ferroelectric capacitor structure. A wiring layer is formed over the upper insulating film. An aluminum oxide film of thickness 5 to 50 nm is formed so as to cover the wiring layer and upper insulating film.

REFERENCES:
patent: 2001/0020708 (2001-09-01), Kasai
patent: 2004/0084701 (2004-05-01), Kanaya et al.
patent: 2005/0101034 (2005-05-01), Aggarwal et al.
patent: 2007/0134924 (2007-06-01), Yaegashi
patent: 2002-043541 (2002-02-01), None
patent: 2003-100994 (2003-04-01), None
patent: 2004-023043 (2004-01-01), None

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