Ferroelectric memory device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S298000, C257S303000, C257S306000, C257S324000, C438S003000, C438S240000

Reexamination Certificate

active

06927437

ABSTRACT:
The present invention provides a ferroelectric memory device and a manufacturing method forming the same capable of preventing characteristic deterioration of a ferroelectric layer due to an plasma. The ferroelectric memory device divided into a first area including a plurality of ferroelectric capacitor and a second area not including the ferroelectric capacitor, includes a semiconductor substrate; a first insulating layer formed on the semiconductor substrate; and a bottom electrode of the ferroelectric capacitor formed in the first insulating layer, wherein a top surface of the bottom electrode is planarized with the first insulating layer; a ferroelectric layer of the ferroelectric capacitor covering not only the bottom electrode but also all the first area; and a top electrode of the ferroelectric capacitor formed on the ferroelectric layer and overlapped with the bottom electrode.

REFERENCES:
patent: 5994153 (1999-11-01), Nagel et al.
patent: 6046469 (2000-04-01), Yamazaki et al.
patent: 6090657 (2000-07-01), Yamoto et al.
patent: 6133108 (2000-10-01), New
patent: 6458604 (2002-10-01), Yang
patent: 6521929 (2003-02-01), Ozaki
patent: 11-274406 (1999-10-01), None
patent: 2001-007304 (2001-01-01), None
patent: 1999-013932 (1999-02-01), None
patent: 2001-0004364 (2001-01-01), None

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