Feedback controlled polishing processes

Details Feedback controlled polishing processes Feedback controlled polishing processes

2007-07-24

2007-07-24

Shakeri, Hadi (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S006000, C451S008000, C451S041000

Reexamination Certificate

active

11397075

ABSTRACT:
Methods and apparatus for feedback controlled polishing. A computer program product for generating feedback for chemical mechanical polishing. The product includes instructions operable to cause a processor to receive monitoring information during a current polishing cycle in which a first polishing process is performed on a substrate that includes a metal layer. The first polishing process clears the metal layer from the substrate during the current polishing cycle. The product includes instructions to calculate a representation of a clearing profile of the first polishing process. The calculation is based on the monitoring information received during the current polishing cycle. The product includes instructions to detect non-uniformity in the representation. The product includes instructions to generate, from the non-uniformity detected, feedback information for improving the uniformity of a clearing profile of the first polishing process for a subsequent polishing cycle.

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