Feedback controlled polishing processes

Details Feedback controlled polishing processes Feedback controlled polishing processes

2006-04-04

2006-04-04

Shakeri, Hadi (Department: 3723)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S164000, C700S175000, C700S195000, C438S692000, C451S005000, C451S006000

Reexamination Certificate

active

07024268

ABSTRACT:
Methods and apparatus for feedback controlled polishing. A computer program product for generating feedback for chemical mechanical polishing. The product includes instructions operable to cause a processor to receive monitoring information during a current polishing cycle in which a first polishing process is performed on a substrate that includes a metal layer. The first polishing process clears the metal layer from the substrate during the current polishing cycle. The product includes instructions to calculate a representation of a clearing profile of the first polishing process. The calculation is based on the monitoring information received during the current polishing cycle. The product includes instructions to detect non-uniformity in the representation. The product includes instructions to generate, from the non-uniformity detected, feedback information for improving the uniformity of a clearing profile of the first polishing process for a subsequent polishing cycle.

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