Fe-Ni alloy materials for electronic parts

Details Fe-Ni alloy materials for electronic parts Fe-Ni alloy materials for electronic parts

1997-11-17

2000-02-15

Ip, Sikyin

Metal treatment

Process of modifying or maintaining internal physical...

Heating or cooling of solid metal

148628, 148631, 148633, C22C 3808

Patent

active

060248092

ABSTRACT:
Fe--Ni alloy with improved etch factors for electronic parts are provided which are characterized by the composition consisting of, all by weight, 30-55% Ni, 0.8% or less Mn, 0.0030-0.0100% N, or 0.02% less Al, and the balance Fe and unavoidable impurities, preferably with 0.01% or less C, 0.003% or less Si, 0.005%, or less S, 0.005% or less P, and 0.0100% or less O. There is provided Fe--Ni alloy materials for electronic parts which have high etch factors and produce favorably etched surfaces without blister generation, by restricting the N and Al contents within specified ranges and preferably limiting C, Si, P, S, and O contents below specified levels.

REFERENCES:
patent: 4816216 (1989-03-01), Chao et al.

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