Alloys or metallic compositions – Tin base – Lead containing
Patent
1993-02-10
1994-05-03
Dean, W.
Alloys or metallic compositions
Tin base
Lead containing
420559, 2282629, C22C 1300
Patent
active
053085787
ABSTRACT:
The fatigue resistance of lead-tin eutectic solder is increased by doping the solder with about 0.1 to 0.8 weight % of a dopant selected from cadmium, indium antimony and mixtures thereof. The doped eutectic solder exhibits increased resistance to thermally or mechanically induced cyclic stress and strain. As a result, the fatigue resistance of the solder joint is increased. Combination of dopants, such as indium and cadmium, in combined amounts of less than 0.5 weight % are especially effective in increasing the fatigue resistance of the lead-tin eutectic solder.
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Dean W.
Denson-Low W. K.
Hughes Aircraft Company
Lachman M. E.
Phipps Margery S.
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