Fast wafer positioning method for optical metrology

Optics: measuring and testing – By alignment in lateral direction – With light detector

Reexamination Certificate

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C356S620000

Reexamination Certificate

active

07030984

ABSTRACT:
A fast wafer positioning method for optical metrology includes three main steps. In the first step, an initial measurement recipe is constructed for the host system and target wafer. In the next step, the host system performs a test run using the initial measurement and the target wafer. In this step, the initial measurement recipe is refined to eliminate positioning errors produced by the host system. In the final step, the refined measurement recipe is used by the host system to process production wafers (e.g., as part of a production environment). This is performed using the information included in the refined measurement recipe without reference to optical images of the wafers being processed.

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patent: 2003/0142313 (2003-07-01), Katayama

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