Fast firing flattening apparatus for sintered multilayer...

Plastic article or earthenware shaping or treating: apparatus – Control means responsive to or actuated by means sensing or... – Temperature control

Reexamination Certificate

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Details

C425S338000, C425S384000, C425S388000

Reexamination Certificate

active

10942559

ABSTRACT:
An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.

REFERENCES:
patent: 3535132 (1970-10-01), Lunde
patent: 3589880 (1971-06-01), Clark
patent: 4477402 (1984-10-01), Ezis
patent: 4508671 (1985-04-01), Ezis
patent: 5182121 (1993-01-01), Miyashita et al.
patent: 5496433 (1996-03-01), Miyashita et al.
patent: 5932043 (1999-08-01), Bates et al.
patent: 6721163 (2004-04-01), Iwase et al.

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