Fan out type wafer level package structure and method of the...

Details Fan out type wafer level package structure and method of the... Fan out type wafer level package structure and method of the...

2007-08-28

2007-08-28

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21499

Reexamination Certificate

active

11169722

ABSTRACT:
To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.

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