Failure analysis apparatus of semiconductor integrated circuits

Details Failure analysis apparatus of semiconductor integrated circuits Failure analysis apparatus of semiconductor integrated circuits

1998-06-25

2000-07-18

Picardat, Kevin M.

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

438 14, 438 18, G01R 3126, H01L 2166

Patent

active

060906340

ABSTRACT:
First of all, after removing a passivation film on a failure pellet area, a timing failure level of the pellet area is digitized using a tester. Then, a polyimide solution is dropped on the upper semi-circular region of the pellet area. Then, the timing failure level of the pellet after forming the polyimide film is digitized using the tester again. Thereafter, the timing failure value after forming the polyimide film and the timing failure value before forming the polyimide film is compared. Then, based on the comparison results, the region with failure is judged. Then, repeating the step of selectively forming the polyimide film on the region with failure and the step of judging the region with failure, the failure region is identified.

REFERENCES:
patent: 5113241 (1992-05-01), Yanagida et al.
patent: 5288664 (1994-02-01), Mukai
patent: 5815000 (1998-09-01), Farnworth et al.

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