Fabrication process using a thin liftoff stencil formed by...

Details Fabrication process using a thin liftoff stencil formed by... Fabrication process using a thin liftoff stencil formed by...

2005-07-05

2005-07-05

Walke, Amanda (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

Reexamination Certificate

active

06913870

ABSTRACT:
A material is deposited on a substrate by depositing a liftoff layer overlying the substrate, thereafter depositing a hard-mask layer overlying the liftoff layer, thereafter depositing an image layer in registry with a retained portion of the hard-mask layer, leaving a nonretained portion of the hard-mask layer which is not in registry with the image layer. The method further includes removing the nonretained portion of the hard-mask layer, removing at least a part of the thickness of the image layer, and removing a nonretained portion of the liftoff layer, which may include an undercut under the hard-mask layer. The deposited material is deposited onto the substrate from a source, and the retained portion of the hard-mask layer and any part of the liftoff layer remaining between the hard-mask layer and the substrate is thereafter removed.

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