Fabrication process for narrow groove

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156656, 156657, 1566591, 156662, 437241, 437245, H01L 21306, B44C 122, C03C 1500, C23F 100

Patent

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053285549

ABSTRACT:
In a process for producing a narrow groove in a layer of, for example, silicon nitride, a wide groove is first formed in the layer. A layer of a metal, for example aluminium, is evaporated on to one side of the wide groove. The remainder of the wide groove is then filled with a material such a silicon nitride. The metal layer is then etched away, leaving a narrow groove in the silicon nitride equal to the thickness of the metal layer.

REFERENCES:
patent: 4053349 (1977-10-01), Simko
patent: 4460434 (1984-07-01), Johnson et al.
patent: 4650544 (1987-03-01), Erb et al.

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