Fabrication process for EPROM cells with oxide-nitride-oxide die

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156657, 1566591, 156662, 357 235, 357 59, 437 52, 437191, 437233, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

048082619

ABSTRACT:
The process calls for covering of the dielectric with a thin additional layer of polysilicon which has the function of protecting the dielectric from any defects which would otherwise be introduced from the subsequent masking.

REFERENCES:
patent: 4426764 (1984-01-01), Kosa et al.
patent: 4458407 (1984-07-01), Hoeg et al.
patent: 4688078 (1987-08-01), Hseih
patent: 4720323 (1988-01-01), Sato et al.

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