Fabrication process and structure for a contacted-body silicon-o

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257304, 257305, 257349, 257350, 257401, H01L 27108, H01L 2701, H01L 2976

Patent

active

056061889

ABSTRACT:
An SOI DRAM includes a direct body contact between the SOI layer and the silicon substrate, and field-shield isolation positioned on the surface of the SOI structure which extends over the direct body contact. Deep trench storage capacitors are positioned adjacent the direct body contact.

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IBM Technical Disclosure Bulletin, "Method For Making a Dynamic Random-Access Memory Cell" vol. 32 No. 4A Sep. 1989.

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