Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2006-08-29
2006-08-29
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
C438S780000, C427S250000, C427S255170
Reexamination Certificate
active
07098145
ABSTRACT:
A self-assembled monolayer (SAM) is fabricated using either a semi-fluorinated sulphur containing compound, or a sem-fluorinated silane derivative and compressed carbon dioxide (CO2) as the solvent medium. The temperature and/or pressure of the compressed CO2may be varied during the fabrication process to improve the molecular packing density of the monolayer.By using compressed CO2as the solvent medium, monolayers with good molecular packing density can be fabricated relatively quickly without the use of environmentally unfriendly solvents.
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H. Fukushima and 2 others, “Microstructure, Wettability, and Thermal Stability of Semifluorinated Self-Assembled Monolayers (SAMs) on Gold” J. Phys. Chem. B 2000, 104, pp. 7417-7423.
Notification of Reasons of Rejection dated Jun. 8, 2005 in corresponding Japanese application No. JP2001-370544.
Fukushima Hitoshi
Holmes Andrew
Huck Wilhelm
Ishida Masaya
Luscombe Christine K
Ghyka Alexander
Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
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