Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1978-04-24
1980-01-01
Massie, Jerome W.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156657, 156662, 204192EC, 427 38, 427 88, 427 94, 427 95, H01L 21285, H01L 21306
Patent
active
041815645
ABSTRACT:
A method of forming patterned insulating layers such as silicon nitride for use in integrated circuit fabrication is disclosed. The insulating layer is formed by reactive plasma deposition while the temperature of the substrate is decreased. This diminishing temperature affects the etching characteristics of the layer such that when openings are formed by a selective plasma etching, the sidewalls will be sloped at an acute angle with the substrate even when the layer is overetched.
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Fogarty Thomas N.
Harshbarger William R.
Porter Roy A.
Bell Telephone Laboratories Incorporated
Birnbaum Lester H.
Massie Jerome W.
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