Fabrication of multi-level relief patterns in a substrate

Details Fabrication of multi-level relief patterns in a substrate Fabrication of multi-level relief patterns in a substrate

1977-06-17

1978-11-07

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

C23C 1500

Patent

active

041244737

ABSTRACT:
Superposed multi-level diffraction gratings in photoresist can be etched into a substrate by using the photoresist as a masking pattern and by sputtering in a reactive fluoromethane plasma to a predetermined depth.

REFERENCES:
patent: 3971684 (1976-07-01), Muto
patent: 3975252 (1976-08-01), Fraser et al.
patent: 3984301 (1976-10-01), Matsuzaki et al.
N. Hosokawa et al., "RF Sputter Etching by Fluoro-Chloro-Hydrocarbon Gases," Proc. 6th Int'l. Vac. Cong. (1974), pp. 435-438.
J. A. Bondur et al., "RF Reactive Ion Etching of Polysilicon with Fluorocarbon Gas", IBM Tech. Disc. Bull., vol. 18, p. 1897, (1975).
J. A. Bondur, "Dry Process Technology (Reactive Ion Etching)", J. Vac. Sci. Tech., vol. 13, pp. 1023-1029, (1976).

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