Fabrication of metal pillars in an electronic component using po

Details Fabrication of metal pillars in an electronic component using po Fabrication of metal pillars in an electronic component using po

1991-04-11

1992-08-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156637, 156644, 156645, 156651, 156656, 1566591, 156902, B44C 122, C23F 100

Patent

active

051375974

ABSTRACT:
A method for fabricating metal pillars in an electronic component. The method includes providing a base with spaced vias in a top surface, depositing an electrically conductive metal into the vias and over the top surface of the base so that a metal layer with an uneven top surface forms over the base, and planarizing the metal by polishing. The polishing can remove the entire metal layer leaving metal pillars in and aligned with the base. Or the polishing can be completed before removing the metal layer and metal above the base between the vias can be etched to form metal pillars with uniform heights which extend above the base. The invention is well suited for fabricating high-density multilayer copper/polyimide electrical interconnects.

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