Fabrication of large power semiconductor composite by wafer inte

Details Fabrication of large power semiconductor composite by wafer inte Fabrication of large power semiconductor composite by wafer inte

1986-12-29

1989-03-28

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 8, 437173, 437195, 437924, 437935, 148DIG93, 148DIG162, 357 75, H01L 700

Patent

active

048164224

ABSTRACT:
A method for fabricating a composite semiconductor from a plurality of substantially identical individual semiconductor devices formed on a common semiconductor wafer includes testing the devices on the wafer to generate a positional mapping of acceptable and non-acceptable devices, dividing the wafer into a plurality of areas of arbitrary size, connecting corresponding contact pads on only the acceptable devices within a given area to each other via common conductive paths which are supported on a dielectric film covering the pads, the film having appropriately located holes filled with conductive material to electrically couple the common conductive paths and the underlying contact pads of only the acceptable devices. The devices within a given area are intercoupled in a manner to form an operational array; single or multiple arrays may be coupled together to form a composite package having common external contacts and heat sink supports.

REFERENCES:
patent: 3641661 (1972-02-01), Canning et al.
patent: 3702025 (1972-11-01), Archer
patent: 3707036 (1972-12-01), Okabe et al.
patent: 3810301 (1974-05-01), Cook
patent: 3835530 (1974-09-01), Kilby
patent: 3839781 (1974-10-01), Russel
patent: 3897626 (1975-09-01), Beausoleil
patent: 3984860 (1976-10-01), Logue
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4034399 (1977-07-01), Drukier et al.
patent: 4240094 (1980-12-01), Mader
patent: 4347306 (1982-08-01), Takeda et al.
patent: 4364044 (1982-12-01), Kusamo
patent: 4414059 (1983-11-01), Blum et al.
patent: 4417948 (1983-11-01), Mayne-Bantom et al.
patent: 4578697 (1986-03-01), Takemae
patent: 4617085 (1986-10-01), Cole, Jr. et al.
patent: 4617193 (1986-10-01), Wu
patent: 4639760 (1987-01-01), Gromberg et al.
Canning et al., "Active Memory Calls for Discretion", Electronics, Feb. 20, 67, pp. 143-154.
Charles A. Harper, "Handbook of Materials and Processes for Electronics", McGraw-Hill Book Company, New York, 1984, pp. 12-73-12-74.

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