Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-01-25
1995-02-07
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156644, 156647, 156657, 1566591, 156662, H01L 21306, B44C 122, C03C 1500, B29C 3700
Patent
active
053873149
ABSTRACT:
An ink fill slot can be precisely manufactured in a substrate utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots are appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead by means of an extended portion that results in a reduced shelf length and thus reduced fluid impedance imparted to the ink. The extended portion is precisely etched to controllably align it with other elements of the printhead.
REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 4601777 (1986-07-01), Hawkins et al.
patent: 4612554 (1986-09-01), Poleshuk
patent: 4638337 (1987-01-01), Torpey et al.
patent: 4789425 (1988-12-01), Drake et al.
patent: 4829324 (1989-05-01), Drake et al.
patent: 4851371 (1989-07-01), Fisher et al.
patent: 4863560 (1989-09-01), Hawkins
patent: 4875968 (1989-10-01), O'Neill et al.
patent: 4882595 (1989-11-01), Trueba et al.
patent: 4899178 (1990-02-01), Tellier
patent: 4899181 (1990-02-01), Hawkins et al.
patent: 4961821 (1990-10-01), Drake et al.
patent: 5160577 (1992-11-01), Deshpande
patent: 5308442 (1994-05-01), Taub et al.
K. E. Bean, "Anisotropic Etching of Silicon", in IEEE Transactions on Electron Devices, vol. ED-25, No. 10, pp. 1185-1192 (Oct. 1978).
K. E. Petersen, "Silicon as a Mechanical Material", in Proceedings of the IEEE, vol. 70, No. 5, pp. 420-457 (May 1982).
E. Bassous, "Fabrication of Novel Three-Dimensional Microstructures by the Anisotropic Etching of (100) and (110) Silicon", in IEEE Transactions on Electron Devices, vol. ED-25, No. 10, pp. 1178-1185 (Oct. 1978).
Baughman Kit C.
Kahn Jeffrey A.
McClelland Paul H.
Tappon Ellen R.
Trueba Kenneth E.
Hewlett--Packard Company
Powell William
LandOfFree
Fabrication of ink fill slots in thermal ink-jet printheads util does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fabrication of ink fill slots in thermal ink-jet printheads util, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication of ink fill slots in thermal ink-jet printheads util will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1108357