Fabrication of devices utilizing a wet etchback procedure

Details Fabrication of devices utilizing a wet etchback procedure Fabrication of devices utilizing a wet etchback procedure

1989-12-21

1991-01-29

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156662, 252 793, 437 61, 437228, 437231, H01L 21265

Patent

active

049884050

ABSTRACT:
Smoothing irregularities in a surface is accomplished by a wet-etchback technique. In this technique, a polysilicate composition is formed on a nonplanar substrate such as the surface of an integrated-circuit wafer. The polysilicate is etched away and the etching is continued into the underlying surface. As a result, a substantial smoothing of the surface is obtained.

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patent: 4806504 (1989-02-01), Cleeves
patent: 4826786 (1989-05-01), Merenda et al.
patent: 4885262 (1989-12-01), Ting et al.
A. C. Adams, VLSI Technology, 2nd ed., S. M. Sze, editor, McGraw-Hill, New York, 1988, Chapter 6.
L. F. Thompson and M. J. Bowden, Introduction to Microlithography, L. F. Thompson, et al., editors, ACS Symposium Series 219, American Chemical Society, Washington, D.C., 1983, Chapter 4.
Sze, supra, Chapters 4 and 5.

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