Fabrication of customized integrated circuits

Details Fabrication of customized integrated circuits Fabrication of customized integrated circuits

1988-03-23

1989-10-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156653, 156656, 156657, 1566591, 357 71, 428209, 428446, 428622, 428633, 437 56, 437195, B44C 122, C23F 102, C03C 1500, H01L 21306

Patent

active

048759716

ABSTRACT:
A technique for production of customized integrated circuits comprising the steps of providing an integrated circuit blank having at least first and second metal layers including portions arranged for selectable removal to provide desired customization of said integrated circuit blank, and thereafter etching at least said first metal layer to customize said integrated circuit blank.

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