Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-11-05
1989-04-11
Lacey, David L.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156656, 156668, 439 66, 439 91, 439591, H01R 4300
Patent
active
048203769
ABSTRACT:
Disclosed is a method of fabricating conductive polymer interconnect (CPI) material which employs chains of electrically conductive particles within an elastomeric matrix. Contact resistance is improved by removing a thin layer is elastomeric material which remains after normal processing. The surface layer is removed by plasma etching so that the conductive particles protrude at both surfaces. The protruding particles can be plated to replace any conductive material removed by the etch.
REFERENCES:
patent: 3541222 (1970-11-01), Parks et al.
patent: 3795037 (1974-03-01), Luttmer
patent: 4295699 (1981-10-01), Durocher
patent: 4408814 (1983-10-01), Takashi et al.
patent: 4475983 (1984-10-01), Bader et al.
patent: 4568412 (1986-02-01), Atkins et al.
patent: 4599137 (1986-07-01), Akiya
patent: 4615763 (1986-10-01), Gelorme et al.
Lambert William R.
Lu Neng-Hsing
Rust Ray D.
American Telephone and Telegraph Company AT&T Bell Laboratories
Anderson Andrew J.
Birnbaum Lester H.
Lacey David L.
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