Fabrication of conductor-clad composites using molding compounds

Details Fabrication of conductor-clad composites using molding compounds Fabrication of conductor-clad composites using molding compounds

1980-02-15

1982-04-06

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29846, 29848, 264241, 264259, 264DIG64, B32B 3106, B32B 3124, H05K 306

Patent

active

043234216

ABSTRACT:
Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.

REFERENCES:
patent: 3079645 (1963-08-01), Cosmos
patent: 3505141 (1970-04-01), Sorensen et al.
patent: 3784664 (1974-01-01), Nicklin
patent: 3889363 (1975-06-01), Davis
patent: 4023998 (1977-05-01), Cederberg

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