Fabrication multilayer combined rigid/flex printed circuit board

Details Fabrication multilayer combined rigid/flex printed circuit board Fabrication multilayer combined rigid/flex printed circuit board

1995-05-25

1997-01-07

Ryan, Patrick

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428209, 428352, 428458, 428901, 174259, 174260, B32B 900

Patent

active

055915191

ABSTRACT:
Multilayer rigid flex printed circuits are fabricated from a novel basestock composite comprising two copper conducting sheets, bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to Kapton layers wherein said Kapton layers are not coextensive with the borders of the insulator layers. The basestock composite can then be imaged and etched on the conductor layers to form conductor patterns, laminated or coated with a coverlay of dielectric material, and the basestock can be cut at a point internal to its borders and into the Kapton layers thereby separating two imaged and etched conductor layers.

REFERENCES:
patent: 4861648 (1989-08-01), Kleinschmidt et al.
patent: 5162140 (1992-11-01), Taniguchi
patent: 5374469 (1994-12-01), Hino et al.

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