Fabrication method of semiconductor package with...

Details Fabrication method of semiconductor package with... Fabrication method of semiconductor package with...

2006-01-24

2006-01-24

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S113000, C438S116000, C438S125000

Reexamination Certificate

active

06989296

ABSTRACT:
A fabrication method of a semiconductor package with a photosensitive chip is provided. A substrate having a core is prepared. An interposer is mounted on the substrate, with a peripheral portion of the substrate exposed from the interposer. A molding process is performed and the substrate is clamped between an upper mold and a lower mold, with the interposer received in an upwardly-recessed cavity of the upper mold. A molding compound is injected into the upwardly-recessed cavity to form a dam on the peripheral portion of the substrate. Then the upper and lower molds and the interposer are removed from the substrate to expose area covered by the interposer on the substrate. At least one photosensitive chip is mounted on the exposed area of the substrate. A lid seals the dam such that the chip is received in a space defined by the substrate, the dam and the lid.

REFERENCES:
patent: 6011304 (2000-01-01), Mertol
patent: 6060340 (2000-05-01), Chou
patent: 6262479 (2001-07-01), Chou
patent: 6384472 (2002-05-01), Huang
patent: 6590269 (2003-07-01), Chuang et al.
patent: 6784534 (2004-08-01), Glenn et al.
patent: 6900531 (2005-05-01), Foong et al.

Affiliated with

Also associated with

Rating

Fabrication method of semiconductor package with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabrication method of semiconductor package with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication method of semiconductor package with... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3528956