Fabrication method of semiconductor device

Details Fabrication method of semiconductor device Fabrication method of semiconductor device

2007-04-16

2009-12-08

Garber, Charles D. (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S460000, C438S465000, C228S180220

Reexamination Certificate

active

07629231

ABSTRACT:
A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

REFERENCES:
patent: 6619535 (2003-09-01), Imanishi et al.
patent: 7015071 (2006-03-01), Wada et al.
patent: 7115482 (2006-10-01), Maki et al.
patent: 2005/0059205 (2005-03-01), Maki et al.
patent: 2005/0061856 (2005-03-01), Maki et al.
patent: 1 321 966 (2003-06-01), None
patent: 2002-280398 (2002-09-01), None
patent: 2003-203964 (2003-07-01), None
patent: 2004-6599 (2004-01-01), None
patent: 2004-022995 (2004-01-01), None
patent: 2004-128339 (2004-04-01), None
patent: 2004-228255 (2004-08-01), None
patent: 2004-304066 (2004-10-01), None
patent: 2005-093838 (2005-04-01), None
patent: 2005-117019 (2005-04-01), None
patent: 2005-150311 (2005-06-01), None
patent: 2005-322815 (2005-11-01), None
patent: 2006-24729 (2006-01-01), None

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