Fabrication method of a three-dimensional microstructure

Details Fabrication method of a three-dimensional microstructure Fabrication method of a three-dimensional microstructure

2006-10-31

2006-10-31

McPherson, John A. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S394000, C430S950000

Reexamination Certificate

active

07129025

ABSTRACT:
A fabrication method of three-dimensional microstructures is to fabricate a real 3D microstructure. First, a substrate is coated with an anti-reflection layer to absorb reflected exposure light, and then the anti-reflection layer is overlaid with a first thick photoresist. After having been fully exposed by a first photo mask, a predetermined exposure depth of the first thick photoresist is achieved by a second photo mask and dosage-controlled UV exposure. If the unexposed areas of the first thick photoresist are released during a development step, a single-layer microstructure is created. Inversely, a multi-layered microstructure can be obtained simply by repeating the process described above. After all layers are laminated on the substrate, all unexposed areas of the all thick photoresist layers are released and connected to each other during a development step.

REFERENCES:
patent: 6245492 (2001-06-01), Huang et al.
patent: 6569575 (2003-05-01), Biebuyck et al.
patent: 6762012 (2004-07-01), Kim et al.
patent: 2003/0091936 (2003-05-01), Rottstegge et al.
patent: 2004/0259042 (2004-12-01), Fritze et al.

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