Fabrication method for thin-film semiconductor

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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C438S745000, C438S798000, C438S149000

Reexamination Certificate

active

06979632

ABSTRACT:
The present invention has as its object to provide a technique of forming a surface of a thin-film semiconductor having corrugations and smoothing the same. This is achieved by a fabrication method for thin-film semiconductors which smooths a surface of a silicon film having corrugations, comprising the steps of forming an oxidized silicon film on the surface of the silicon film, removing the oxidized silicon film which has been formed in protruding portions among the corrugations and exposing at least part of protruding portions in the silicon film, and removing the protrusions in the silicon film exposed in the previous step. In the above structure, the silicon film having corrugations has an average thickness of about 100 Å to 1000 Å (e.g. an amorphous silicon film or a crystalline silicon film crystallized by thermal processing) which is irradiated by a laser beam and crystallized or a silicon layer promoting crystallization.

REFERENCES:
patent: 4992846 (1991-02-01), Sakakibara et al.
patent: 5260232 (1993-11-01), Muroyama et al.
patent: 5320708 (1994-06-01), Kadomura et al.
patent: 5437762 (1995-08-01), Ochiai et al.
patent: 5496764 (1996-03-01), Sun
patent: 5585661 (1996-12-01), McLachlan et al.
patent: 5641380 (1997-06-01), Yamazaki et al.
patent: 5747385 (1998-05-01), Torii
patent: 5786242 (1998-07-01), Takemura et al.
patent: 5851861 (1998-12-01), Suzawa et al.
patent: 5891763 (1999-04-01), Wanlass
patent: 6489241 (2002-12-01), Thilderkvist et al.
patent: 52-131471 (1977-11-01), None
patent: 61-216329 (1986-09-01), None
patent: 63-161620 (1988-07-01), None
patent: 01-027242 (1989-01-01), None
patent: 01-270313 (1989-10-01), None
patent: 03-099421 (1991-04-01), None
patent: 04-119631 (1992-04-01), None
patent: 04-180624 (1992-06-01), None
patent: 8153875 (1996-06-01), None
patent: 08-255916 (1996-10-01), None
Takahashi, et al., “Oxide-semiconductor interface roughness and electrical properties of polycrystalline silicon thin-film transistors”, Appl. Phys. Lett., vol. 64, No. 17, pp. 2273-2275, Apr. 25, 1994.
Cao, et al., “A Low Thermal Budget Polysilicon Thin Film Using Chemical Mechanical Polishing”, Supported by the ARPA grant MDA 972-92-J-1001, Center for Integrated Systems, Stanford University, Stanford, CA 94305, pp. 294-297.

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