Fabrication method for semiconductor hole

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S313000, C430S314000

Reexamination Certificate

active

06852453

ABSTRACT:
A fabrication method for a semiconductor hole is described. The method provides a circular or a elliptical hole pattern. A first exposure is performed with a first photomask that comprises a plurality of diagonally allocated square patterns wherein the square patterns on the first photomask are tilted at an angle of 45 degrees. Thereafter, a second exposure is performed using a second photomask, wherein patterns on the second photomask are mirror images to those on the second photomask to prevent the peeling of the photoresist at between the diagonally allocated hole patterns.

REFERENCES:
patent: 5610754 (1997-03-01), Gheen et al.
patent: 6134008 (2000-10-01), Nakao
patent: 20030039893 (2003-02-01), Farnsworth et al.
patent: 20030104319 (2003-06-01), Lin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fabrication method for semiconductor hole does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabrication method for semiconductor hole, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication method for semiconductor hole will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3495845

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.