Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-11-07
1990-12-04
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 156634, 156644, 156645, 156656, 1566591, 156902, 427 97, B44C 122, C23F 102, C03C 1500, B29C 3700
Patent
active
049751425
ABSTRACT:
A double-sided printed circuit board includes a component side and a circuit side. The dielectric material is undesirably flexible. To render the board rigid, the conductor bonded to the component side is a rigid plate. At locations at which plated-through component signal leads are to be attached, lead clearance holes are drilled through all the way through the thin conductor, the dielectric, and the plate. The holes are plated with conductor. From the exposed side of the plate, larger holes are drilled coaxial with the clearance holes, part-way through the plate. The hold bottoms make an acute angle with the axes. The exposed surfaces are plated with etch resist. A second depth-controlled drilling coaxial with the first is performed with a drill which has a reverse-angle face, to a depth which extends almost through the plate, to thereby remove etch resist in an annular region surrounding the original clearance hole. The plate is etched sufficiently to free an annular region around each clearance hole from conductor.
REFERENCES:
patent: 3351953 (1972-11-01), Sear
patent: 3649475 (1972-03-01), Degnan et al.
patent: 4663208 (1987-05-01), Ninomiya et al.
"PTFE Substrates Require Special Care in Fabrication" by Donegan, published in Oct., 1982 issue of Microwaves magazine.
"Grounding of Surface Mount Components" by Meier, published at pp. 17-20 of the Arp., 1989 issue of the periodical Surface Mount Technology.
"Miniaturized Microwave Packaging--A Different Game" by Markstein, published in the Aug., 1982 issue of Electronic Packaging and Production.
"Printed Circuit Integration of MW Filters" by Rooney et al., published at pp. 2-6 of the Microwave Journal and distributed by Rogers Corporation.
"Microwave Stripline Packaging with VMDS" by Traut, published in Microwave Journal, Aug. 1975.
Iannacone Joseph M.
Ibbetson Lawrence J.
General Electric Company
Meise William H.
Powell William A.
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