Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-12-17
1994-03-01
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156656, 1566611, H02N 100
Patent
active
052904008
ABSTRACT:
A microelectromechanical transducer including a plurality of strips arranged in an array and maintained in a closely spaced relation by a plurality of spacers. An electrically conductive layer on portions of the strips and spacers distributes electrical signal within the transducer to cause adjacent portions of the strips to move together. The strips and spacers may be formed from a common dielectric layer using microelectronic fabrication techniques. Two transducers may be coupled at an angle offset from parallel for two-dimensional micropositioning. A photodetector and Fresnel lens may be combined with the micropositioner using the transducers for optical scanning microscopy.
REFERENCES:
patent: 2975307 (1961-03-01), Schroeder et al.
patent: 3008014 (1961-11-01), Williamson et al.
patent: 3153229 (1964-10-01), Roberts
patent: 3315103 (1967-04-01), Duff et al.
patent: 3345469 (1967-10-01), Rod
patent: 3389226 (1968-06-01), Peabody
patent: 4034332 (1977-07-01), Alais
patent: 4042438 (1977-08-01), Kawakami et al.
patent: 4160882 (1979-07-01), Driver
patent: 4206369 (1980-06-01), Lewiner et al.
patent: 4207442 (1980-06-01), Freeman
patent: 4342935 (1982-08-01), Kallmeyer et al.
patent: 4384230 (1983-05-01), Wisner
patent: 4429190 (1984-01-01), Stockbridge
patent: 4510412 (1985-04-01), Suda et al.
patent: 4615591 (1986-10-01), Smith et al.
patent: 4665610 (1987-05-01), Barth
patent: 4678955 (1987-07-01), Toda
patent: 4721447 (1988-01-01), Erckmann
patent: 4789803 (1988-12-01), Jacobsen et al.
patent: 4814657 (1989-03-01), Yano et al.
patent: 4841191 (1989-06-01), Takata et al.
patent: 4863252 (1989-09-01), McCarthy et al.
patent: 4887248 (1989-12-01), Griebeler
patent: 4897592 (1990-01-01), Hyde
patent: 5001381 (1991-03-01), Watanabe
patent: 5113566 (1992-05-01), Weekamp et al.
PCT International Search Report dated Mar. 23, 1992 of International Appln. No. PCT/US 91/08901 filed Nov. 25, 1991.
Silicon Micromechanics: Sensors and Actuators on a Chip, SPECTRUM, Jul. 1990, Howe, R. T. et al., University of California at Berkley; Gabriel, K. J. et al., AT&T Bell Laboratories.
Dang Thi
MCNC
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