Fabrication method for encapsulated micromachined structures

Details Fabrication method for encapsulated micromachined structures Fabrication method for encapsulated micromachined structures

1997-03-03

2000-11-14

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438 52, 438456, 257415, 257787, H01L 2982

Patent

active

061469173

ABSTRACT:
A process for the preparation of hermetically sealed electronically active microstructures involves the preparation of a plurality of microstructures and associated conductive paths and lead bond areas on a single wafer such that areas surrounding the microstructures are maintained in a planar condition. A second wafer having a plurality of microstructure-receiving cavities is placed atop the first wafer and fusion or anodically bonded. The microstructures are preferably connected to lead bond pads which lie outside the surround, the second wafer also having bond pad accessing through-holes to facilitate bonding electrical leads to the devices after sawing from the wafer. The lead-connected devices may be further encapsulated by injection molding, potting, or other conventional encapsulative packaging techniques.

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