Fabrication method

Details Fabrication method Fabrication method

2004-08-23

2008-11-04

Dang, Trung (Department: 2892)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S946000, C257SE21579

Reexamination Certificate

active

07446057

ABSTRACT:
A method for forming a multilevel structure on a surface by depositing a curable liquid layer on the surface; pressing a stamp having a multilevel pattern therein into the liquid layer to produce in the liquid layer a multilevel structure defined by the pattern; and, curing the liquid layer to produce a solid layer having the multilevel structure therein. Mechanical alignment may be employed to enhance optical alignment of the stamp relative to the substrate via spaced protrusions on the substrate on which the structure is to be formed and complementary recesses in the patterning of the stamp.

REFERENCES:
patent: 6247986 (2001-06-01), Chiu et al.

Affiliated with

Also associated with

Rating

Fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabrication method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4043832