Fabricating process of non-gap 3-D microstructure array mold...

Details Fabricating process of non-gap 3-D microstructure array mold... Fabricating process of non-gap 3-D microstructure array mold...

2002-06-01

2004-06-08

Huff, Mark F. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S330000, C430S270100, C257S741000, C264S002500, C264S001360, C264S001100, C428S172000, C205S118000, C205S122000, C204S192170

Reexamination Certificate

active

06746823

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to a filling technology capable of effective elimination of gap in microstructure array.
BACKGROUNG OF THE INVENTION
The microlens is an essential component part of optical and optoelectronic products. For example, the microlens is used as a light condenser at the end of optical fiber, or as a focusing means of optical scanner. In addition, the microlens is used to construct the microlens array of display. Moreover, the microlens is used as a light condenser of micro-optic integrated element. The conventional process of making a microlens array is incapable of eliminating microgap of the microlens array. The microgap undermines the resolution of the product.
The Taiwan Pat. Series No. 89122015 discloses a batch process for fabricating microlens array. The process is described hereinafter with reference to FIG.
1
. The process involves a first step in which a substrate
100
is coated with a polyimide composite layer
210
and a photomask composite layer
220
. The coated substrate
100
is then patterned by lithography, thereby resulting in formation of a bottom layer of the polyimide composite
210
and a plurality of top layers of photomask composite
220
, as shown in FIG.
1
B and FIG.
1
C. The patterned substrate
100
is heated subsequently at a temperature ranging between 180° C. and 220° C., so as to bring about reflow. In the meantime, the photomask layer
220
has transformed into a microlens
230
due to equilibrium of cohesive force and surface tension, as shown in FIG.
1
D. In light of transformation of microlens array by reflow, the coated substrate
100
is patterned at intervals by lithography, so as to prevent the reflow overlapping phenomenon in the course of the reflow. As a result, there are gaps in the microlens array. The gaps undermine the resolution of the microlens array. The gaps of the microlens array may be eliminated by a presision mechanical process, a photomask process, or laser process. However, these processes are neither cost-effective nor efficient.
SUMMARY OF THE INVENTION
The primary objective of the present invention is to provide a filling technology capable of effective elimination of gaps in a microstructure array, thereby resulting in enhancement of resolution of the microstructure array.
It is another objective of the present invention to provide a process for fabricating a non-gap microstructure array in high density so as to reduce effectively the unit ares.
It is still another objective of the present invention to provide a simple and cost-effective process for fabricating microstructure arrays of various forms.


REFERENCES:
patent: 5325265 (1994-06-01), Turlik et al.
patent: 5664325 (1997-09-01), Fukutomi et al.
patent: 6503384 (2003-01-01), Teshima et al.
patent: 2002/0110757 (2002-08-01), Fork et al.
patent: 2002/0114084 (2002-08-01), Summersgill et al.

Affiliated with

Also associated with

Rating

Fabricating process of non-gap 3-D microstructure array mold... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fabricating process of non-gap 3-D microstructure array mold..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fabricating process of non-gap 3-D microstructure array mold... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3361513