Fabricating method of light emitting diode package

Details Fabricating method of light emitting diode package Fabricating method of light emitting diode package

2011-07-05

2011-07-05

Chu, Chris (Department: 2815)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S024000, C257SE27008, C257S081000, C257S099000, C136S201000, C136S203000, C372S038100

Reexamination Certificate

active

07972877

ABSTRACT:
A method of fabricating a light emitting diode package structure is provided. First, a first circuit substrate having a first surface and a corresponding second surface and a second circuit substrate having a third surface and a corresponding fourth surface are provided. The second surface and the third surface respectively have a plurality of electrodes. Then, a plurality of N-type semiconductor materials and a plurality of P-type semiconductor materials alternatively arranged on the electrodes are formed. Then, the first circuit substrate and the second circuit substrate are assembled. The two type semiconductor materials are located between the electrodes of the first circuit substrate and the second circuit substrate. The two type semiconductor materials are electrically connected to the first circuit substrate and the second circuit substrate through the electrodes. Finally, an LED chip is arranged on the first surface and electrically connected to the first circuit substrate.

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