Fabricating dielectric layer

Details Fabricating dielectric layer Fabricating dielectric layer

2006-03-21

2010-11-09

Culbert, Roberts (Department: 1716)

Coating processes

Electrical product produced

Metallic compound coating

C427S126400

Reexamination Certificate

active

07829137

ABSTRACT:
A composition for forming a dielectric layer includes a liquid organometallic compound serving as a precursor with high dielectric constant, a photo-sensitive polymer or a non-photo-sensitive polymer and a solvent, wherein the liquid organometallic compound includes metal alkoxide, and the metal of the metal alkoxide includes Al Ti, Zr, Ta, Si, Ba, Ge and Hf. The dielectric layer formed by the composition includes the photo-sensitive polymer or the non-photo-sensitive polymer and an amorphous metal oxide formed therein.

REFERENCES:
patent: 4170672 (1979-10-01), Moriya et al.
patent: 5792592 (1998-08-01), Uchida et al.
patent: 5858462 (1999-01-01), Yamazaki
patent: 6586791 (2003-07-01), Lee et al.

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