Extremely-thin silicon-on-insulator transistor with raised...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S163000

Reexamination Certificate

active

07871869

ABSTRACT:
An extremely-thin silicon-on-insulator transistor is provided that includes a buried oxide layer above a substrate, a silicon layer above the buried oxide layer, a gate stack on the silicon layer, a nitride liner on the silicon layer and adjacent to the gate stack, an oxide liner on and adjacent to the nitride liner, and raised source/drain regions. The gate stack includes a high-k oxide layer on the silicon layer and a metal gate on the high-k oxide layer. Each of the raised source/drain regions has a first part comprising a portion of the silicon layer, a second part adjacent to parts of the oxide liner and the nitride liner, and a third part above the second part. Also provided is a method for fabricating an extremely-thin silicon-on-insulator transistor.

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