Extreme ultraviolet lithography mask blank and manufacturing met

X-ray or gamma ray systems or devices – Specific application – Lithography

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378 35, 378 84, G21K 106

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059784415

ABSTRACT:
A reflective element for extreme ultraviolet semiconductor lithography systems substantially minimizes the phase transitions of reflected extreme ultraviolet light by a reflective multilayer coating on an extremely planar surface which is parallel to a family of (111) crystallographic planes of a single crystal silicon wafer. The extremely planar surface is made by using three of the families of (111) crystallographic planes of the single crystal silicon as etch barriers for anisotropic etchants.

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Early, Experimental Characterization and Physical Modeling of Resolution Limits in Proximity Printing X-Ray Lithography, RLE Technical Report No. 565, Aug. 1991, pp. 2,139-154, Massachusetts Institute of Technology, Cambridge, MA.
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