Extended defect sizing

Details Extended defect sizing Extended defect sizing

2007-02-27

2007-02-27

Barlow, John (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system

Statistical measurement

C702S127000

Reexamination Certificate

active

10971694

ABSTRACT:
A system for inspecting semiconductor wafers capable of determining a scattering power associated with a wafer surface detect whether or not the scattering power exceeds the dynamic range of the system. The scattering power is obtained by determining the height of a Gaussian shape representing data collected by the system. The height is determined by defining a plurality of cross-sectional areas of the Gaussian shape, determining a value of each area, determining a value of the natural logarithm of intermediate heights of the Gaussian shape corresponding to the cross-sectional areas, plotting the area values as function of the natural logarithm of the intermediate height values to form a linear plot, determining a natural logarithm of the height value corresponding to a zero area value based on the linear plot, and determining the inverse natural logarithm of the value to obtain the height of the Gaussian shape.

REFERENCES:
patent: 5712701 (1998-01-01), Clementi et al.
patent: 2003/0058455 (2003-03-01), Ebihara et al.

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