Exposure method and method of manufacturing semiconductor...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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Details

C430S005000, C355S053000, C355S071000, C355S067000

Reexamination Certificate

active

06872508

ABSTRACT:
Disclosed is an exposure method comprising preparing an exposure apparatus including an illumination system and a projection lens, setting, in the exposure apparatus, a photomask having a mask pattern including a plurality of unit circuit patterns arranged like a checkered flag pattern and a plurality of unit auxiliary patterns arranged between the unit circuit patterns, and projecting the mask pattern onto a substrate through the projection lens by irradiating the photomask with light from the illumination system, wherein the unit circuit patterns and the unit auxiliary patterns generate a plurality of diffraction light spots on a pupil plane of the projection lens, and the four diffraction light spots having higher light intensities than the remaining diffraction light spots are distributed on the pupil plane in a cycle of 90°.

REFERENCES:
patent: 5357311 (1994-10-01), Shiraishi
patent: 6636293 (2003-10-01), Shiraishi
patent: 6654101 (2003-11-01), Suzuki et al.
patent: 5-326370 (1993-12-01), None
patent: 6-77111 (1994-03-01), None
patent: 2633091 (1997-04-01), None
patent: 2890892 (1999-02-01), None
patent: 3009923 (1999-12-01), None
patent: 3119217 (2000-10-01), None
patent: 1996-6686 (1996-05-01), None

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